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Absolute Maximum Ratings (T A = 25°C unless otherwise speci?ed)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
T OPR
T STG
Parameter
Operating Temperature
Storage Temperature
Rating
-40 to +100
-40 to +100
Unit
°C
°C
T SOL-I
T SOL-F
Soldering Temperature
Soldering Temperature
(Iron) (2,3,4)
(Flow) (2,3)
240 for 5 sec
260 for 10 sec
°C
°C
V BR
Reverse Breakdown Voltage
50
V
P D
Power
Dissipation (1)
100
mW
Notes:
1. Derate power dissipation linearly 1.33mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16” (1.6mm) minimum from housing.
Electrical/Optical Characteristics (T A =25°C)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
λ PS
Peak Sensitivity Wavelength
880
nm
λ SR
Θ
V F
I D
Wavelength Sensitivity Range
Reception Angle
Forward Voltage
Reverse Dark Current
I F = 80mA
V R = 10V, Ee = 0
400
±20
1.3
1100
10
nm
°
V
nA
I L
V O
TC V
I SC
TC I
C
t r
Reverse Light Current
Open Circuit Voltage
Temperature Coef?cient of V O
Short Circuit Current
Temperature Coef?cient of I SC
Capacitance
Rise Time
Ee = 0.5mW/cm 2 , V R = 5V,
λ = 950nm
Ee = 0.5mW/cm 2 , λ = 880nm
Ee = 0.5mW/cm 2 , λ = 880nm
V R = 0, f = 1MHz, Ee = 0
V R = 5V, R L = 50 ? , λ = 950nm
15
25
420
+0.6
50
+0.3
60
5
μA
mV
mV / K
μA
% / K
pF
ns
t f
Fall Time
5
?2010 Fairchild Semiconductor Corporation
QSD2030 Rev. 1.1.1
2
www.fairchildsemi.com
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